Compact and Multi-Band Open Slot Antennas for Carbon-Fiber AI Glasses
Ziheng Ding, Jingyi Shi, City University of Hong Kong, China; Meiling Li, Goertek Technology Co., Ltd., China; Yongxin Guo, City University of Hong Kong, China

Wideband High-Efficiency Six-Beam Full-Metal Satellite L-Band Antenna Array
Javier Vera-Sánchez, Miguel Ferrando-Rocher, Gorka Casasús-Goyeneche, Miguel Ferrando-Bataller, Universitat Politècnica de València, Spain

A Highly Integrated Tri-Band Antenna Design for Simultaneous 4G/5G and 6G Communication
XING-YU CHENG, Fanchao Zeng, University of Technology Sydney, Australia; ken Taylor, T/A Silvertone Electronics, Australia; Alessio Monti, Filliberto Billoti, Roma Tre University, Italy; Francisco Pizarro, Pontificia Universidad Católica de Valparaíso, Chile; can ding, University of Technology Sydney, Australia

Wideband Phased Arrays Enabled by Direct Antenna Modulation
Javaria Aslam, Younes Radi, Syracuse University, United States

Near-Field Millimeter-Wave Radar Sensing of a Slot-Loaded Dielectric Resonator
Yu Cao, University of Waterloo, Canada; Mohammad Omid Bagheri, BioWRIX Sensing Inc. and University of Waterloo, Canada; Xiaohan Zhang, Veronica Leong, Brayden Arthur Herbert, University of Waterloo, Canada; Juewen Liu, Bionanotechnology and Interfaces Lab and University of Waterloo, Canada; George Shaker, Spark Tech Labs and University of Waterloo, Canada

AI-Accelerated Robust Chamber-Reflection-Aware Position Selection for MIMO RTS OTA Measurements
Jun Li, Dalian Maritime University, China; Aoqi Ye, The Chinese University of Hong Kong, China; Bin Lin, Yihong Qi, Dalian Maritime University, China

High-Isolation In-Band Full-Duplex Antenna Array with Reflector-Integrated All-Metal Decoupling Structure
Tong Wen, Peng Fei Hu, Sun Yat-sen University, China; Kwok Wa Leung, City University of Hong Kong, China; Yong Mei Pan, South China University of Technology, China

Planar Inverted-F Antenna Sensors on an Artificial Magnetic Conductor Meta-Surface for Focused Near-Field Sensing
Kapil Gangwar, Edwin Kan, Cornell University, United States

Loss-Optimized Reconfigurable Nonlocal Metasurface-aided Cavity Antenna
Minwoo Cho, Jeong-Hae Lee, Minseok Kim, Hongik University, Korea (South)

Transmissive Reconfigurable Intelligent Surface for Millimeter-Wave 5G Smart Radio Environments
Suchitra Tiwari, Interdisciplinary Centre for Security, Reliability and Trust, University of Luxembourg, Luxembourg; Amit K. Singh, Indian Institute of Technology Patna, India; Satish Sharma, San Diego State University, United States

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Goal and Scope:

The Industry Application Idea Pitch Competition aims to spotlight innovative, industry-driven ideas that bridge research and commercialization in antennas and propagation. This full-day session at the IEEE AP-S Symposium will focus on practical, scalable concepts that demonstrate potential for real-world deployment, business value, and societal impact. Participants will pitch ideas addressing commercialization pathways, business models, market strategies, and revenue opportunities.

Eligibility Requirements:

Eligible submissions should present actionable and industry-relevant applications of antenna or electromagnetic technologies. These may include:

• A novel or enhanced technology concept with strong commercialization potential
• A system or process that improves performance, cost-effectiveness, or manufacturability
• A business or market strategy built on antenna/EM innovation
• A concept demonstrating clear pathways to industry adoption or startup formation

To qualify, the first author must be a student (undergraduate, graduate) or postdoctoral researcher affiliated with a university or college. Collaborative work involving industry partners is encouraged but not required.

Submission and Review Process:

• Authors must follow the regular IEEE AP-S Symposium paper submission process.
• During submission, please check the box labeled Industry Application Pitch Competition.
• Submissions will be reviewed for originality, practicality, commercial relevance, and clarity.
• Selected finalists (up to 10) will be invited to deliver live pitches during the Symposium's dedicated Industry Application Idea Pitch session.

Competition Format and Awards:

Finalists will present their ideas to a panel of four distinguished judges, including venture capitalists, startup founders, CTOs, and industry executives. The session will emphasize feedback, visibility, and potential connections to investment and collaboration opportunities.

Monetary Awards:

• 1st Prize: $5,000
• 2nd Prize: $3,000
• 3rd Prize: $2,000
  

Similar to SPC, students designated as Finalists of Industry Application Pitch Competition will receive an award, issued after the Symposium upon successful in-person completion of their presentation. Finalists who are unable to attend in person are not eligible to receive the financial award but will retain the finalist title. In addition, the Top 3 winners will receive supplemental awards of $5,000, $3,000, and $2,000 for the 1st, 2nd, and 3rd Prize winners, respectively. All required tax (i.e., IRS) and IEEE forms will follow the standard process.

Each student may apply for both the Industry Application Pitch Competition and other travel grants to attend the IEEE APS/URSI meeting. However, a student can receive only one award or grant. If a student is selected as a Industry Application Pitch Competition finalist, and is also awarded another travel grant (including travel grant for SPC) to support attendance at the AP-S Symposium, the student must accept only one of these awards and decline the others.

Evaluation Criteria:

Judging will consider:

• Industry and market relevance
• Feasibility and innovation
• Potential business and commercialization impact
• Clarity and quality of presentation

Expected Outcomes:

• Increased collaboration between academia, startups, and industry
• Exposure to venture funding and technology transfer opportunities
• Recognition of applied innovation within the AP-S community