MO-A6.2P.2
Charge-Conserving Particle-in-Cell (CONPIC) Electromagnetic Solvers: Applications, Features, and Parallelization Aspects
Haitham Saleh, The Ohio State University, United States; Dong-Yeop Na, Pohang University of Science and Technology, Korea (South); Indranil Nayak, Stanford University, United States; Fernando Teixeira, Balasubramaniam Shanker, The Ohio State University, United States
Session:
Multiphysics Simulation Methods Oral
Track:
AP-S: Track 6: Computational Electromagnetics
Location:
Room 355
Session Time:
Mon, 13 Jul, 13:20 - 15:00
Presentation Time:
Mon, 13 Jul, 13:40 - 14:00
Presentation
Discussion
Session MO-A6.2P
MO-A6.2P.1: A Numerical Approach to Investigate the Impact of Electrode Shape and Partial Dielectric Barrier on Nanosecond High-Voltage Arc Discharge
Md Rayhan Khan, Saranraj Karuppuswami, General Motors, United States
MO-A6.2P.2: Charge-Conserving Particle-in-Cell (CONPIC) Electromagnetic Solvers: Applications, Features, and Parallelization Aspects
Haitham Saleh, The Ohio State University, United States; Dong-Yeop Na, Pohang University of Science and Technology, Korea (South); Indranil Nayak, Stanford University, United States; Fernando Teixeira, Balasubramaniam Shanker, The Ohio State University, United States
MO-A6.2P.3: Electrothermal coupling analysis of electromagnetic transmission systems with loss
Zhan Tang, University of Electronic Science and Technology of China, China; Li Xu, Shenzhen Institute for Advanced Study, University of Electronic Science and Technology of China, China; Huiqi Huang, Jiyu Zhang, Honghai Fan, Hangxin Liu, Hao Wang, Bingqi Liu, Bin Li, University of Electronic Science and Technology of China, China
MO-A6.2P.4: Efficient Algorithm for Co-Simulating Maxwell's and Drift-Diffusion Equations in Time Domain
Hsin-Yu Tsern, Hongyang Liu, Dan Jiao, Purdue University, United States
MO-A6.2P.5: Matrix-Free Time Domain Finite Element Method for Electromagnetic-Thermal Simulation of Metasurfaces
Yi-Yao Wang, Qiwei Zhan, Wen-Yan Yin, Zhejiang University, China
Resources
No resources available.