MO-A1.1P.3
Additively Manufactured Multilayer Fan-out Interposer
Lucas Unger, Alkim Akyurtlu, University of Massachusetts Lowell, United States
Session:
Additive Manufacturing and Integration Oral
Track:
AP-S: Track 1: Antenna Modeling, Design, Fabrication
Location:
Huntington: Room 252B
Session Time:
Mon, 13 Jul, 13:20 - 15:00
Presentation Time:
Mon, 13 Jul, 14:00 - 14:20
Session Co-Chairs:
Adib Nashashibi, U Michigan and Premjeet Chahal, Michigan State University and Ethan Kepros, Michigan State University and Saptarshi Mukherjee, LLNL
Presentation
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Discussion
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Session MO-A1.1P
MO-A1.1P.1: Ultrathin Glass Chiplet Patch Antenna and Glass-to-Glass Bonding with Aerosol Jet Printing
Ethan Kepros, Premjeet Chahal, Michigan State University, United States
MO-A1.1P.2: Microwave volumetric additive manufacturing for ceramics
Saptarshi Mukherjee, Ethan Rosenberg, Johanna Vandenbrande, Emer Baluyot, Johanna Schwartz, Joe Tringe, James Kelly, Lawrence Livermore National Laboratory, United States; Corey Dechant, Casey Icenhour, Donna P. Guillen, Evan Butterworth, Idaho National Laboratory, United States; Nelson Bell, Kevin Strong, Sandia National Laboratories, United States
MO-A1.1P.3: Additively Manufactured Multilayer Fan-out Interposer
Lucas Unger, Alkim Akyurtlu, University of Massachusetts Lowell, United States
MO-A1.1P.4: Compact Mm-Wave Antenna Arrays with Structurally Integrated Active Devices
Harshen Patel, Ruoke Liu, Jing Wang, Gokhan Mumcu, University of South Florida, United States
MO-A1.1P.5: Hybrid Additive Manufacturing of a Low-Profile Embedded LTE Antenna
William Stricklan, Christopher Stricklan, Gilbert Carranza, Kraetonics, LLC, United States
Resources